Yamaichi Electronics has introduced new test contactors within its YED254 and YED274 series for testing ultra-fine pitch semiconductor devices.
New semiconductor devices such as wafer level CSPs for mobile applications have ball pitches of 0.35mm. The TCs can be custom designed for different dimensions. A homogenous force distribution on the device surface is important to avoid device cracking. It is designed with compression mount technology, therefore no soldering is needed.
November 3, 2015
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